Timmerhaus Advances in Cryogenic Engineering

Advances in Cryogenic Engineering

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Volume 22

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Beschreibung

The First International Cryogenic Materials Conference (ICMC) provided a new forum for the presentation of low-temperature materials research. The confer ence, held in conjunction with the 1975 Cryogenic Engineering Conference, provided materials research personnel with excellent exposure to current develop ments in the cryogenics field and beneficial interactions with designers of cryogenic systems. Because of the large response to a late call for papers, the enthusiasm and encouragement at the meeting, and the wide spectrum and high quality of papers, the Second International Cryogenic Materials Conference is being planned along with the 1977 Cryogenic Engineering Conference for Boulder, Colorado, in the summer of 1977. The success of the First International Cryogenic Materials Conference was certainly in large measure due to the excellent hospitality of our Canadian hosts, the Royal Military College of Canada and Queen's University in Kingston, Ontario. In particular, the efforts of A. C. Leonard and his staff ensured an excellent conference and a pleasant and memorable visit to Canada. The Cryogenic Engineering Conference Board was both generous and skillful in helping to initiate this new conference and their guidance and acceptance is gratefully acknowledged. The Cryogenic Engineering Conference program chairman, M. J. Hiza, greatly facilitated the interaction for the two conferences and provided valuable assistance in generat ing a workable program. The proceedings of the 1975 Cryogenic Engineering Conference are published as Volume 21 of the Advances in Cryogenic Engineering and include many papers indicating innovative use of new cryogenic materials properties data.

Autor*in

K. Timmerhaus

Themen in »Advances in Cryogenic Engineering«

cryogenics design engine growth hospital material materials materials properties mechanics optimization quality research simulation temperature

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Details

ISBN: 9781461398523
Verlag: Springer US
Erscheinung: 12.10.2012

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