Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
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Beschreibung
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
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Erdogan Madenci
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From the reviews:
"Fatigue Life Prediction of Solder Joints in Electronic Packages … excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. … there must by now be this book on the bookshelf of every one concerned with fatigue reliability analyses of solder joints which is an important issue in the electronics industry." (Current Engineering Practice, Vol. 47, 2002-2003)
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