Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
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Beschreibung
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of timing, power, signal integrity, and thermo-mechanical reliability for 3D IC designs. Coverage also includes various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the 3D IC design process.
- Describes design issues and solutions for high performance and low power 3D ICs, such as the pros/cons of regular and irregular placement of TSVs, Steiner routing, buffer insertion, low power 3D clock routing, power delivery network design and clock design for pre-bond testability.
- Discusses topics in design-for-electrical-reliability for 3D ICs, such as TSV-to-TSV coupling, current crowding at the wire-to-TSV junction and the electro-migration failure mechanisms in TSVs.
- Covers design-for-thermal-reliability in 3D ICs, including thermal-aware architectural floorplanning, gate-level placement techniques to alleviate thermal problems, and co-design and co-analysis of thermal, power delivery, and performance.
- Includes issues affecting design-for-mechanical-reliability in 3D ICs, such as the co-efficient of thermal expansion (CTE) mismatch between TSV and silicon substrate, device mobility and full-chip timing variations, and the impact of package elements.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs Features sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs Provides full details of all key algorithms, for maximum understanding and utility Includes design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process Includes supplementary material: sn.pub/extras
Autor*in
Sung Kyu Lim
Themen in »Design for High Performance, Low Power, and Reliable 3D Integrated Circuits«
Design for Manufacturability Design for Reliability Design for Testability Electronic Design Automation Embedded Systems GDSII layouts Integrated Circuits and Systems TSV Three Dimensional Integrated Circuits Through Silicon Via