Advanced Interconnects for ULSI Technology
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Beschreibung
Finding new materials for copper/low-k interconnects is critical tothe continuing development of computer chips. While copper/low-kinterconnects have served well, allowing for the creation of UltraLarge Scale Integration (ULSI) devices which combine over a billiontransistors onto a single chip, the increased resistance andRC-delay at the smaller scale has become a significant factoraffecting chip performance.
Advanced Interconnects for ULSI Technology is dedicatedto the materials and methods which might be suitable replacements.It covers a broad range of topics, from physical principles todesign, fabrication, characterization, and application of newmaterials for nano-interconnects, and discusses:
* Interconnect functions, characterisations, electricalproperties and wiring requirements
* Low-k materials: fundamentals, advances and mechanical properties
* Conductive layers and barriers
* Integration and reliability including mechanical reliability,electromigration and electrical breakdown
* New approaches including 3D, optical, wireless interchip, andcarbon-based interconnects
Intended for postgraduate students and researchers, in academiaand industry, this book provides a critical overview of theenabling technology at the heart of the future development ofcomputer chips.
Autor*in
Mikhail Baklanov
Themen in »Advanced Interconnects for ULSI Technology«
Circuit Theory & Design / VLSI / ULSI Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Halbleiterphysik Materials Science Materialwissenschaften Physics Physik Schaltkreise - Theorie u. Entwurf / VLSI / ULSI Semiconductor Physics ULSI