THERMEC 2009 Supplement
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Beschreibung
Supplement to THERMEC 2009, 6th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, Berlin, Germany, August 25-29, 2009
Volume is indexed by Thomson Reuters CPCI-S (WoS).
This proceedings supplement contains further selected papers from the 6th International Conference on Processing and Manufacturing of Advanced Materials – THERMEC’2009, held during the period, August 25-29, 2006, in Berlin , Germany under the co-sponsorship of The Minerals, Metals & Materials Society ( TMS) ,USA.
Autor*in
Trans Tech Publications Ltd
Themen in »THERMEC 2009 Supplement«
Aging Biomaterial Copper (Cu) Electron Backscatter Diffraction (EBSD) Heat Treatment Hot Deformation Linear Friction Welding Mechanical Property Microstructure Nanocomposite Nucleation Precipitation Recrystallization Residual Stress