Components, Packaging and Manufacturing Technology
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Beschreibung
Selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields. The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.
Autor*in
Trans Tech Publications Ltd
Themen in »Components, Packaging and Manufacturing Technology«
Analytic Network Process (ANP) Apriori Algorithm Association Rule Chip Manufacture Distributed System Fault Diagnosis Genetic Algorithm (GA) Image Processing Least Squares Support Vector Machines (Ls-SVM) Model Neural Network (NN)