S.D. Holdsworth Holdsworth Thermal Processing of Packaged Foods

Thermal Processing of Packaged Foods

von S.D. Holdsworth

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Beschreibung

Thermal Processing of Packaged Foods, Second Edition, discusses the physical and engineering aspects of the thermal processing of packaged foods and examines the methods that have been used to establish the time and temperature of processes suitable to achieve adequate sterilization or pasteurization of the packaged food. New features in this edition include: The increased use of new packaging materials, including retortable pouches and the use of containers made from other plastic composite materials The application of newer processing methods which use heat transfer media such as hot water, air/steam, and steam/water, which are necessary for the newer forms of packaging material New methods of theoretically calculating the heat transfer characteristics during processing, including three-dimensional modeling and application of computerized fluid dynamics (CFD) techniques The implications of newer models for microbial destruction Revised techniques for process evaluation using computer models, including CD software The development of process schedules for quality optimization in newer packaging materials Important new aspects of methods of retort control Unlike other texts on thermal processing, which cover very adequately the technology of the subject, the unique emphasis of this text is on processing engineering and its relation to the safety of processed foods products.   About the Authors S. Daniel Holdsworth, a former researcher for 25 years with the Campden and Chorleywood Food Research Association. Ricardo Simpson,a professor in Universidad Técnica Federico Santa María, Department of Chemical, Biotechnological and Environmental Processes.

Autor*in

S.D. Holdsworth

Themen in »Thermal Processing of Packaged Foods«

DSI_D015 foodpackaging foodprocessing foodscience packagedfoods thermalprocessing

Stimmen zu »Thermal Processing of Packaged Foods«

Details

ISBN: 9780751403756
Verlag: Springer US
Erscheinung: 31.07.1997

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