Stress-Induced Phenomena in Metallization

Beschreibung

These proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. The volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers.

Autor*in

Ehrenfried Zschech

Themen in »Stress-Induced Phenomena in Metallization«

Electronic materials and devices device reliability materials analysis stress in solder joints stress-induced phenomena in Cu/low-k on-chip interconnect st technology integration

Stimmen zu »Stress-Induced Phenomena in Metallization«

Details

Link teilen