Stress-Induced Phenomena in Metallization

Beschreibung

These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. Papers cover results on electromigration, thermal stresses and void formation in copper-low k interconnect structures.

Autor*in

Paul S. Ho

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Computer chip manufacturing and quality control copper (Cu) interconnects electromigration fracture of low k dielectrics metallization thermal stress

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