The proposed book will offer comprehensive and versatilemethodologies and recommendations on how to determine dynamiccharacteristics of typical micro- and opto-electronic structuralelements (printed circuit boards, solder joints, heavy devices,etc.) and how to design a viable and reliable structure that wouldbe able to withstand high-level dynamic loading. Particularattention will be given to portable devices and systems designedfor operation in harsh environments (such as automotive, aerospace,military, etc.) In-depth discussion from a mechanicalengineer's viewpoint will be conducted to the key components'level as well as the whole device level. Both theoretical(analytical and computer-aided) and experimental methods ofanalysis will be addressed. The authors will identify how thefailure control parameters (e.g. displacement, strain and stress)of the vulnerable components may be affected by the externalvibration or shock loading, as well as by the internal parametersof the infrastructure of the device. Guidelines for materialselection, effective protection and test methods will be developedfor engineering practice.
Ephraim Suhir
Maschinenbau Maschinenbau - Entwurf Mechanical Engineering Mechanical Engineering - Design Strukturdynamik