Modeling and Simulation for Microelectronic Packaging Assembly

Beschreibung

Although there is increasing need for modeling and simulation inthe IC package design phase, most assembly processes and variousreliability tests are still based on the time consuming "test andtry out" method to obtain the best solution. Modeling andsimulation can easily ensure virtual Design of Experiments (DoE) toachieve the optimal solution. This has greatly reduced the cost andproduction time, especially for new product development. Usingmodeling and simulation will become increasingly necessary forfuture advances in 3D package development. In this book, Liuand Liu allow people in the area to learn the basic and advancedmodeling and simulation skills to help solve problems theyencounter. * Models and simulates numerous processes in manufacturing,reliability and testing for the first time * Provides the skills necessary for virtual prototyping andvirtual reliability qualification and testing * Demonstrates concurrent engineering and co-design approachesfor advanced engineering design of microelectronic products * Covers packaging and assembly for typical ICs, optoelectronics,MEMS, 2D/3D SiP, and nano interconnects * Appendix and color images available for download from thebook's companion website Liu and Liu have optimized the book for practicing engineers,researchers, and post-graduates in microelectronic packaging andinterconnection design, assembly manufacturing, electronicreliability/quality, and semiconductor materials. Product managers,application engineers, sales and marketing staff, who need toexplain to customers how the assembly manufacturing, reliabilityand testing will impact their products, will also find this book acritical resource. Appendix and color version of selected figures can be found atwww.wiley.com/go/liu/packaging

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Sheng Liu

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Electrical & Electronics Engineering Electronic Packaging Elektronikbauteile Elektronische Baugruppe Elektrotechnik u. Elektronik

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