Solder Joint Reliability Prediction for Multiple Environments
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Beschreibung
Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Drawing upon years of practical experience and using numerous examples and illustrative applications, Andrew Perkins and Suresh Sitaraman cover state of the art technologies in solder joint reliability, including:
A comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability,
Useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling, and power cycling enviroments,
New insight into solder joint reliability testing under multiple environments, including vibration environments,
A methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type.
Solder Joint Reliability Prediction for Multiple Environments is a must have book for practitioners and researchers who specialize in solder.
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability Develops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and power cycling environments. Offers insight into how to relate accelerated thermal cycling testing conditions to real world applications Offers new insight into solder joint reliability testing under multiple environments, including vibration environments Develops a methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type
Autor*in
Andrew E. Perkins
Themen in »Solder Joint Reliability Prediction for Multiple Environments«
array packages development electronic packages finite element modeling methodology numerical simulations predictive fatigue life reliability simulation solder joint reliability quality control, reliability, safety and risk