Integrated Circuit Packaging, Assembly and Interconnections
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Beschreibung
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.
The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.
This material will provide a suitable knowledge-base essential for individuals who have the need or interest in understanding the basics of electronic manufacturing.
Reviewing various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book details available packaging approaches: single chip, multichip, and Chip On Board; the assembly options, chip and wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.
Delivers the information designers need to implement the right packaging approach for their specific application Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost Focuses on how package trends and assembly options are impacted by the IC and its mechanical, electrical, and thermal characteristics Identifies the IC manufacturing process (Wafer Fab) as a technology resource for the manufacture of high density interconnects Highlights flip chip as the next generation first level interconnect A comprehensive glossary of terms is included Includes supplementary material: sn.pub/extras
Autor*in
William Greig
Themen in »Integrated Circuit Packaging, Assembly and Interconnections«
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